【英文标准名称】:Plasticfilmsforelectricalpurposes.Specificationsforindividualmaterials.Balancedbiaxiallyorientedpolyethylenenaphthalate(PEN)filmsusedforelectricalinsulation
【原文标准名称】:电工塑料薄膜.各种规范.用于电气绝缘的稳定双向拉聚萘二甲酸乙二酯(PEN)
【标准号】:BSEN60674-3-8-2011
【标准状态】:现行
【国别】:英国
【发布日期】:2011-09-30
【实施或试行日期】:2011-09-30
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Determination;Dimensions;Electricstrength;Electricalengineering;Electricalinsulatingmaterials;Electricalinsulation;Electricalinsulationdevices;Ethylpropylene;Foil;Insulatingfilms;Insulatingmaterials;Insulations;Marking;Materials;Physicalproperties;Plasticfilms;Plasticinsulations;Plastics;Polyethyleneterephthalate;Properties;Rolls;Specifications;Thickness
【摘要】:ThisInternationalStandardgivestherequirementsforbalancedbiaxiallyorientedpolyethylenenaphthalate(PEN)filmsforuseaselectricalinsulation.Materialswhichconformtothisspecificationmeetestablishedlevelsofperformance.However,theselectionofamaterialbyauserforaspecificapplicationshouldbebasedontheactualrequirementsnecessaryforadequateperformanceinthatapplicationandnotbasedonthisspecificationalone.Safetywarning:itistheresponsibilityoftheuserofthemethodscontainedorreferredtointhisdocumenttoensurethattheyareusedinasafemanner.
【中国标准分类号】:K15
【国际标准分类号】:29_035_20
【页数】:16P.;A4
【正文语种】:英语
基本信息
| 标准名称： | 晶片承载器 |
| 英文名称： | Wafer carriers |
| 中标分类： |
电子元器件与信息技术 >>
电子工业生产设备 >>
加工专用设备 |
| ICS分类： |
|
| 替代情况： | 作废; |
| 发布部门： | 国家技术监督局 |
| 发布日期： | 1992-01-02 |
| 实施日期： | 1993-08-01 |
| 首发日期： | 1992-12-28 |
| 作废日期： | 2005-10-14 |
| 主管部门： | 信息产业部（电子） |
| 归口单位： | 信息产业部（电子） |
| 起草单位： | 机电部电子标准化所 |
| 出版社： | 中国标准出版社 |
| 出版日期： | 2004-08-09 |
| 页数： | 平装16开， 页数：11， 字数：18千字 |
| 书号： | 155066.1-9646 |
适用范围
本标准规定了晶片承载器的产品分类、技术要求和试验方法、检验规则、包装标志。本标准适用于晶片直径为75、100、125、150mm通用型塑料和金属晶片承载器，以及晶片直径为125mm自动输送型塑料和金属晶片承载器。
前言
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目录
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引用标准
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所属分类： 电子元器件与信息技术 电子工业生产设备 加工专用设备
Product Code:SAE AMS3373
Title:Compound, Silicone Rubber, Insulating and Sealing 35 to 55
Issuing Committee:Ams G9 Aerospace Sealing Committee
Scope: This specification covers elastomeric silicone insulating and sealing compounds supplied as two-component systems which cure at room temperature.These products have been used typically for protecting the electrical integrity of electrical and electronic components by excluding moisture and contamination and by providing resilient cushioning between -50 and +205 degrees C (-58 and +401 degrees F), but usage is not limited to such applications. Compound may be applied by potting or encapsulating.
Rationale: This specification covers elastomeric silicone insulating and sealing compounds supplied as two-component systems which cure at room temperature.These products have been used typically for protecting the electrical integrity of electrical and electronic components by excluding moisture and contamination and by providing resilient cushioning between -50 and +205 degrees C (-58 and +401 degrees F), but usage is not limited to such applications. Compound may be applied by potting or encapsulating.